28th Conference on Electrical Performance of Electronic Packaging and Systems

 | Post date: 2019/04/13 | 
28th Conference on Electrical Performance of Electronic packaging and Systems
2019 EPEPS CONFERENCE
OCTOBER 6-9, 2019

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering:
  1. Emerging and advanced issues,
  2. New design techniques and innovative architectures
  3. Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,
with emphasis on:
  • System-level, board-level, package-level and on-chip interconnects
  • High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
  • RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
  • Signal and thermal integrity
  • Power integrity and power distribution networks
  • Low power mobile and personal applications
  • Memory and DDR interfaces
  • Jitter and noise management
  • Electronic packages and microsystems
  • Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
  • Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
  • Macromodeling and model order reduction as it applies to electrical analysis
  • Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
  • Measurement and data analysis techniques for system‐level and on‐chip structures.
Submission Deadline: July 15, 2019.
Website: 
http://www.epeps.org/
Keywords: EPEPS | Conference | electrical modeling | IEEE Electronics Packaging Society | IEEE Microwave Theory and Techniques Society | IEEE Antenna and Propagation Society |



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© 2019 by the authors. Licensee IUST, Tehran, Iran. This is an open access journal distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial 4.0 International (CC BY-NC 4.0) license.