Iranian Journal of Electrical and Electronic Engineering
Iran University of Science and Technology
Mon, Aug 19, 2019
[Archive]
2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020)
| Post date: 2019/06/16 |
2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020)
The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications.
IMPORTANT DATES
- Deadline for submission of proposals for Special Sessions: February 16, 2020
- Acceptance/rejection notification of proposals for Special Sessions: March 15, 2020
- Deadline for submission of contributions for Regular and Special Sessions, and Industrial Papers:
- April 5, 2020
- Deadline for submission of contributions for SMC Junior Papers:
- April 5, 2020
- Deadline for submission of proposals for Tutorials and Workshop Sessions:
- April 5, 2020
- Acceptance notification for Tutorials and Workshop Sessions: April 26, 2020
- Acceptance notification for Regular and Special Sessions, and Industrial Papers: May 24, 2020
- Acceptance notification for SMC Junior Papers: May 24, 2020
- Submission deadline for Workshop Papers: May 24, 2020
- Final papers due for Regular, Special Sessions, Industrial, SMC Junior, and Workshop Papers: July 12, 2020
- Deadline for early registration: August 2, 2020
- Conference dates: October 11-14, 2020
Website: http://smc2020.org/
2020 IEEE PES T&D CONFERENCE & EXPOSITION
| Post date: 2019/06/16 |
The IEEE PES T&D Conference and Exposition is coming to Chicago, April 20–23, 2020 and power and energy industry professionals from across the world are invited to submit papers, panels, and tutorials on their innovative ideas, research and development, application experience and expertise.
Conference: April 20-23
Exposition: April 21-23
FOR GENERAL QUESTIONS PLEASE EMAIL TDGENERAL
IEEE.ORG
Website: https://www.ieeet-d.org/IEEE20
Conference: April 20-23
Exposition: April 21-23
FOR GENERAL QUESTIONS PLEASE EMAIL TDGENERAL
IEEE.ORGWebsite: https://www.ieeet-d.org/IEEE20
IEEE CCWC 2020
| Post date: 2019/05/10 |
IEEE CCWC 2020 aims to bring together scholars from different disciplinary backgrounds to emphasize dissemination of ongoing research in the fields of in Computing and Communication. Contributed papers are solicited describing original works in the above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions. All accepted papers will be presented during the parallel sessions of the Conference and papers will be submitted for publication at IEEE Xplore Digital Library. IEEE CCWC 2020 is listed in the IEEE conference listing HERE. Topics and technical areas of interest include two main topics: Computing, and Communcation. Authors may access a full detailed list HERE.
Important Deadlines
Full Paper Submission: 31st October 2019
Acceptance Notification: 30th November 2019
Final Paper Submission: 15th December 2019
Early Bird Registration: 15th December 2019
Presentation Submission: 31st December 2019
Conference: 6-8 January 2020
28th Conference on Electrical Performance of Electronic Packaging and Systems
| Post date: 2019/04/13 |
2019 EPEPS CONFERENCE
OCTOBER 6-9, 2019
OCTOBER 6-9, 2019
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering:
- Emerging and advanced issues,
- New design techniques and innovative architectures
- Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,
with emphasis on:
- System-level, board-level, package-level and on-chip interconnects
- High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
- RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
- Signal and thermal integrity
- Power integrity and power distribution networks
- Low power mobile and personal applications
- Memory and DDR interfaces
- Jitter and noise management
- Electronic packages and microsystems
- Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
- Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
- Macromodeling and model order reduction as it applies to electrical analysis
- Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
- Measurement and data analysis techniques for system‐level and on‐chip structures.
Submission Deadline: July 15, 2019.
Website: http://www.epeps.org/
Website: http://www.epeps.org/
6th International Conference on Electrical Engineering, Computer Science and Informatics (EECSI 2019)
| Post date: 2019/04/13 |
6th International Conference on Electrical Engineering, Computer Science and Informatics (EECSI 2019) will be held in Bandung, Indonesia on September 18-20, 2019. This year’s conference theme is “Bridge Toward Industrial Revolution 4.0 and Its Applications on Electrical, Electronics, Computer Science and Informatics for Humanity“. The conference is hosted by Universitas Budi Luhur and is jointly organized with Universitas Gadjah Mada, Universitas Diponegoro, Universitas Sriwijaya, Universitas Ahmad Dahlan, Universitas Islam Sultan Agung, Universitas Muhammadiyah Malang, Universiti Teknologi Malaysia, and IAES Indonesia Section. The event is intended to provide technical forum and research discussion related to advanced engineering on electrical & electronics, computer science and informatics. The conference is aimed to bring researchers, academicians, scientists, students, engineers and practitioners together to participate and present their latest research finding, developments and applications related to the various aspects of electrical, electronics, power electronics, instrumentation, control, robotics, computer & telecommunication engineering, signal, image & video processing, soft computing, computer science and informatics.
Important Dates
Important Dates
- 2nd Batch Papers Submission Deadline: June 30, 2019
- Acceptance Notification (2nd Batch): August 5, 2019
- Camera Ready Submission (2nd Batch) : August 12, 2019
- Early Bird Registration Deadline (1st Batch only): June 30, 2019
- Registration Deadline (2nd Batch): August 15, 2019
- Conference Date: September 18-20, 2019
Website: http://eecsi.org/2019/
Call for Papers NAPS 2019
| Post date: 2019/02/27 |
51st North American Power Symposium will be held at Wichita State University, Wichita, Kansas from October, 13—15, 2019. NAPS, a student-centric conference has been bringing together students, faculty, and researchers in the power and energy systems area since its inception in 1969. The purpose of this symposium is to provide a forum for students, faculty and industrial representatives to discuss research ideas for next generation power grid and present their research outcomes. Authors are invited to submit their original contributions from all areas of power and energy systems including the following tracks:- Power system analysis
- Power system economics
- Modeling and analysis of distribution systems
- Renewable energy systems
- Power electronics and applications
- Electric machines and drives
- Emerging topics in modern power systems
- Undergraduate research
IMPORTANT DATES
Apr. 15, 2019: Paper Submission Opens
Jul. 01, 2019: Deadline for Paper Submission
Jul. 22, 2019: Decision Notification
Aug. 15, 2019: Final Paper Submission
Aug. 31, 2019: Early Bird Registration Deadline
Oct. 13‐15, 2019: North American Power Symposium
Jul. 01, 2019: Deadline for Paper Submission
Jul. 22, 2019: Decision Notification
Aug. 15, 2019: Final Paper Submission
Aug. 31, 2019: Early Bird Registration Deadline
Oct. 13‐15, 2019: North American Power Symposium
For more information: www.wichita.edu/NAPS2019
30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
| Post date: 2019/01/26 |
30th European Symposium on Reliability of
Electron Devices, Failure Physics and Analysis
ESREF 2019, the 30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Toulouse (France) from 23th to 26th September 2019 at Centre de Congrès Pierre Baudis.
This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials, devices and circuits for micro-, nano-, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.
Papers are requested on the following topics:
A - Quality and Reliability assessment techniques and methods for Devices and Systems
B – Semiconductor Failure Mechanisms & Reliability for Si technologies & Nanoelectronics
C – Progress in Failure Analysis: Defect Detection and Analysis
D – Reliability of Microwave devices and circuits
E - Packaging and Assembly Reliability and Failure Analysis
F - Power Devices and Electronic System : Reliability and Failure Analysis
G – Photonics ReliabilityH – MEMS and sensors ReliabilityI - Extreme environments and Radiation
SS : Special Session "Space and Aeronautic systems"
Deadlines :
11 March 2019 Submission of 4-6 pages full paper
29 April 2019 Notification of acceptance
20 May 2019 Submission of the corrected paper following the reviewers comments
10 June 2019 Upload of final paper to the online Elsevier Editorial System (EES)
URL: https://esref2019.sciencesconf.org/
URL: https://esref2019.sciencesconf.org/
SICE Annual Conference 2019
| Post date: 2019/01/25 |
SICE Annual Conference 2019
The SICE Annual Conference 2019 (SICE 2019), organized by the Society of Instrument and Control Engineers (SICE), will be held in September, 2019, in Hiroshima, JAPAN. The SICE Annual Conference 2019 is an international conference covering a broad range of fields from measurement and control to system analysis and design, from theory to application, and from software to hardware. The technical program of SICE 2019 will consist of plenary and invited talks, tutorial courses, and workshops, as well as oral and interactive sessions.
Important Dates (Tentative):
Paper Submission Webpage Open January 1, 2019
Proposal of Workshop and Tutorials February 15, 2019
Proposal of Organized Sessions February 28, 2019
Submission for Regular Papers and Position Papers March 15, 2019
Notification of Paper Acceptance June 1, 2019
Submission of Final Camera-ready Papers July 1, 2019
Address: Higas Send Innovative Research Center, Hiroshima University, Hiroshima, Japan.
URL: http://www.sice.jp/siceac/sice2019/
Important Dates (Tentative):
Paper Submission Webpage Open January 1, 2019
Proposal of Workshop and Tutorials February 15, 2019
Proposal of Organized Sessions February 28, 2019
Submission for Regular Papers and Position Papers March 15, 2019
Notification of Paper Acceptance June 1, 2019
Submission of Final Camera-ready Papers July 1, 2019
Address: Higas Send Innovative Research Center, Hiroshima University, Hiroshima, Japan.
URL: http://www.sice.jp/siceac/sice2019/
10th International Conference on Power Electronics
| Post date: 2018/12/12 |
10th International Conference on Power Electronics - ECCE Asia
Green World with Power Electronics
May 27 (Mon.) ~ 31 (Fri.), 2019
BEXCO, Busan, Korea
BEXCO, Busan, Korea
The 10th International Conference on Power Electronics-ECCE Asia (ICPE 2019-ECCE Asia) will be held on May 27~31, 2019 at the Busan Exhibition & Convention Center (BEXCO) in Busan, Korea. ICPE 2019-ECCE Asia is organized by KIPE (The Korean Institute of Power Electronics), and co-sponsored by IEEE PELS (IEEE Power Electronics Society). As the 10th ICPE since 1989, we will provide an excellent forum for interaction and developing friendship with participants from various countries who are involved in research, development, engineering, manufacturing, and application of power electronics. We wish you all to participate in the ICPE 2019-ECCE Asia in Busan, Korea.
Click HERE to see more information.
Click HERE to see more information.
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