Volume 8, Issue 4 (December 2012)                   IJEEE 2012, 8(4): 280-289 | Back to browse issues page

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Bijari A, Keshmiri S H, Wanburee W, Sriphung C, Phatthanakun R. Design and Fabrication of a Narrow-bandwidth Micromechanical Ring Filter using a Novel Process in UV-LIGA Technology. IJEEE 2012; 8 (4) :280-289
URL: http://ijeee.iust.ac.ir/article-1-517-en.html
Abstract:   (6486 Views)
This paper presents the design and a new low-cost process for fabrication of a second-order micromechanical filter using UV-LIGA technology. The micromechanical filter consists of two identical bulk-mode ring resonators, mechanically coupled by a flexural-mode beam. A new lumped modeling approach is presented for the bulk-mode ring resonators and filter. The validity of the analytical derivation is investigated using the finite element method by ANSYS software. The new low-cost fabrication process is used to achieve a high aspect ratio of 16 with 3 μm gap spacing. The rigid graphite serves as a low-cost primary substrate and plating base of nickel as structural material. The fabrication process needs only three UV-lithography steps with Mylar masks to fabricate the main structure and pattern the printed circuit board as a secondary substrate. The frequency response of the fabricated filter is characterized as a function of the DC-bias voltage using a fully differential drive and sense interface circuit. The experimental results demonstrates micromechanical filter with center frequency in the vicinity of 10.31 MHz and percent bandwidth less than 0.3% using a DC-bias voltage of 60 V. The detailed fabrication process can be applied as an appropriate low-cost alternative to X-ray LIGA and silicon-based micromechanical filters.
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Type of Study: Research Paper | Subject: Semiconductor Devices
Received: 2012/08/05 | Revised: 2012/12/26 | Accepted: 2012/12/26

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© 2022 by the authors. Licensee IUST, Tehran, Iran. This is an open access journal distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial 4.0 International (CC BY-NC 4.0) license.